Betekenis van:
2-dimensional

Voorbeeldzinnen

1. ‘Three dimensional reference system’ means a system as described in Appendix 2 to this Annex;
2. ‘Three-dimensional reference system’ means a system as described in Appendix 2 to this annex;
3. Non-"space-qualified" non-linear (2-dimensional) "focal plane arrays", having individual elements with a peak response in the wavelength range exceeding 1200 nm but not exceeding 30000 nm; d. Non-"space-qualified" linear (1-dimensional) "focal plane arrays", having all of the following: 1. Individual elements with a peak response in the wavelength range exceeding 1200 nm but not exceeding 2500 nm; and
4. Non-"space-qualified" non-linear (2-dimensional) "focal plane arrays" having individual elements with a peak response in the wavelength range exceeding 1200 nm but not exceeding 30000 nm;
5. Non-"space-qualified" non-linear (2-dimensional) infrared "focal plane arrays" based on ’microbolometer’ material having individual elements with an unfiltered response in the wavelength range equal to or exceeding 8000 nm but not exceeding 14000 nm;
6. non-"space-qualified" non-linear (2-dimensional) infrared "focal plane arrays" based on "microbolometer" material having individual elements with an unfiltered response in the wavelength range equal to or exceeding 8000 nm but not exceeding 14000 nm.
7. capable in real time of full three-dimensional image processing or full three-dimensional "scene analysis" to generate or modify "programmes" or to generate or modify numerical programme data; Technical note: The "scene analysis" limitation does not include approximation of the third dimension by viewing at a given angle, or limited grey scale interpretation for the perception of depth or texture for the approved tasks (2 1/2 D).
8. A one-dimensional length "measurement uncertainty" equal to or less (better) than (1,25 + L/1000) μm tested with a probe of an "accuracy" of less (better) than 0,2 μm (L is the measured length in millimetres) (Ref.: VDI/VDE 2617 Parts 1 and 2);
9. Note 7 A ’vector processor’ is defined as a processor with built-in instructions that perform multiple calculations on floating-point vectors (one-dimensional arrays of 64-bit or larger numbers) simultaneously, having at least 2 vector functional units and at least 8 vector registers of at least 64 elements each.
10. Non-"space-qualified""focal plane arrays", as follows: N.B.: Silicon and other material based microbolometer non "space-qualified""focal plane arrays" are only specified in 6A002.a.3.f. Technical Notes: 1. Linear or two-dimensional multi-element detector arrays are referred to as "focal plane arrays"; 2. For the purposes of 6A002.a.3.
11. A one-dimensional length "measurement uncertainty" equal to or less (better) than(1,25 + L/1000) µm tested with a probe of an "accuracy" of less (better) than 0,2 µm (L is the measured length in millimetres) (Ref.:VDI/VDE 2617 Parts 1 and 2);
12. Linear or two-dimensional multi-element detector arrays are referred to as "focal plane arrays"; 2. For the purposes of 6A002.a.3. 'cross scan direction' is defined as the axis parallel to the linear array of detector elements and the 'scan direction' is defined as the axis perpendicular to the linear array of detector elements.
13. Note: 6A002.a.2.b.3. does not control compound semiconductor photocathodes with a maximum radiant sensitivity of 10 mA/W or less. 3. Non-"space-qualified""focal plane arrays", as follows: N.B.: Silicon and other material based microbolometer non "space-qualified""focal plane arrays" are only specified in 6A002.a.3.f. Technical Notes: 1. Linear or two-dimensional multi-element detector arrays are referred to as "focal plane arrays"; 2. For the purposes of 6A002.a.3.
14. Ion plating production equipment allowing for the in situ measurement of any of the following: 1. Coating thickness on the substrate and rate control; or 2. Optical characteristics. Note: 2B005 does not control chemical vapour deposition, cathodic arc, sputter deposition, ion plating or ion implantation equipment specially designed for cutting or machining tools. 2B006 Dimensional inspection or measuring systems, equipment, and "electronic assemblies", as follows: a. Computer controlled or "numerically controlled" co-ordinate measuring machines (CMM), having a three dimensional (volumetric) maximum permissible error of indication (MPEE) at any point within the operating range of the machine (i.e., within the length of axes) equal to or less (better) than (1,7 + L/1000) μm (L is the measured length in mm), tested according to ISO 10360-2 (2001); N.B.: SEE ALSO 2B206. b. Linear and angular displacement measuring instruments, as follows:
15. In 2B204 the inside chamber dimension is that of the chamber in which both the working temperature and the working pressure are achieved and does not include fixtures. That dimension will be the smaller of either the inside diameter of the pressure chamber or the inside diameter of the insulated furnace chamber, depending on which of the two chambers is located inside the other. 2B206 Dimensional inspection machines, instruments or systems, other than those specified in 2B006, as follows: a. Computer controlled or numerically controlled dimensional inspection machines having both of the following characteristics: 1. Two or more axes; and 2. A one-dimensional length "measurement uncertainty" equal to or less (better) than (1,25 + L/1000) μm tested with a probe of an "accuracy" of less (better) than 0,2 μm (L is the measured length in millimetres) (Ref.: VDI/VDE 2617 Parts 1 and 2); b. Systems for simultaneously linear-angular inspection of hemishells, having both of the following characteristics: 1. "Measurement uncertainty" along any linear axis equal to or less (better) than 3,5 μm per 5 mm; and 2. "Angular position deviation" equal to or less than 0,02°. Note 1: Machine tools that can be used as measuring machines are controlled if they meet or exceed the criteria specified for the machine tool function or the measuring machine function.