Betekenis van:
piece of material

Voorbeeldzinnen

1. The use of codends and extension pieces which are made of only one piece of net material and have only one selvedge shall be prohibited.
2. are formed by means of diffusion processes, implantation processes or deposition processes in or on a single semiconducting piece of material, a so-called "chip";
3. Are formed by means of diffusion processes, implantation processes or deposition processes in or on a single semiconducting piece of material, a so-called 'chip'; b. Can be considered as indivisibly associated; and
4. "Diffusion bonding" (1 2 9) means a solid state molecular joining of at least two separate metals into a single piece with a joint strength equivalent to that of the weakest material.
5. The material of the yarn of the codend and the extension piece shall be of polyethylene threads with a single twine thickness of no more than 6 mm or with double twine thickness of no more than 4 mm. This provision shall not apply to the rear most row of meshes in the codend if fitted with a codline.
6. "Diffusion bonding" (1 2 9) means a solid state molecular joining of at least two separate metals into a single piece with a joint strength equivalent to that of the weakest material. "Digital computer" (4 5) means equipment which can, in the form of one or more discrete variables, perform all of the following: a. Accept data;
7. "Monolithic integrated circuit" (3) means a combination of passive or active ’circuit elements’ or both which: a. Are formed by means of diffusion processes, implantation processes or deposition processes in or on a single semiconducting piece of material, a so-called ’chip’; b. Can be considered as indivisibly associated; and c. Perform the function(s) of a circuit.
8. "Monolithic integrated circuit" (3) means a combination of passive or active "circuit elements" or both which: a. are formed by means of diffusion processes, implantation processes or deposition processes in or on a single semiconducting piece of material, a so-called "chip"; b. can be considered as indivisibly associated; and c. perform the function(s) of a circuit.
9. "Monolithic integrated circuit" (3) means a combination of passive or active 'circuit elements' or both which: a. Are formed by means of diffusion processes, implantation processes or deposition processes in or on a single semiconducting piece of material, a so-called 'chip'; b. Can be considered as indivisibly associated; and c. Perform the function(s) of a circuit.
10. According to verified information collected during the investigation, there is no clear price difference between ‘tape’ grade and a black piece-dyed PFF: the higher cost of raw material used for ‘tape’ grade seems to be compensated by the absence of cost for dyeing or printing.
11. The large-mesh topside chafer consists of a rectangular piece of netting made of the same twine material as the codend, or of a single, thick, knotless twine material, attached to the rear portion of the upper side of the codend and extending over all or any part of the upper side of the codend and having in all its parts a mesh size twice that of the codend when measured wet and fastened to the codend along the forward, lateral and rear edges only of the netting in such a way that each mesh of the netting coincides with four meshes of the codend.
12. "Monolithic integrated circuit" (3) means a combination of passive or active "circuit elements" or both which: a. are formed by means of diffusion processes, implantation processes or deposition processes in or on a single semiconducting piece of material, a so-called "chip"; b. can be considered as indivisibly associated; and c. perform the function(s) of a circuit. N.B.:"circuit element" is a single active or passive functional part of an electronic circuit, such as one diode, one transistor, one resistor, one capacitor, etc. "Monospectral imaging sensors" (6) are capable of acquisition of imaging data from one discrete spectral band.
13. "Development" (GTN NTN All) is related to all phases prior to serial production, such as: design, design research, design analyses, design concepts, assembly and testing of prototypes, pilot production schemes, design data, process of transforming design data into a product, configuration design, integration design, layouts. "Diffusion bonding" (1 2 9) means a solid state molecular joining of at least two separate metals into a single piece with a joint strength equivalent to that of the weakest material. "Digital computer" (4 5) means equipment which can, in the form of one or more discrete variables, perform all of the following:
14. "Missiles" (1 3 6 7 9) means complete rocket systems and unmanned aerial vehicle systems, capable of delivering at least 500 kg payload to a range of at least 300 km. "Monofilament" (1) or filament is the smallest increment of fibre, usually several micrometres in diameter. "Monolithic integrated circuit" (3) means a combination of passive or active ’circuit elements’ or both which: a. Are formed by means of diffusion processes, implantation processes or deposition processes in or on a single semiconducting piece of material, a so-called ’chip’; b. Can be considered as indivisibly associated; and
15. "Monolithic integrated circuit" (3) means a combination of passive or active "circuit elements" or both which: a. are formed by means of diffusion processes, implantation processes or deposition processes in or on a single semiconducting piece of material, a so-called "chip"; b. can be considered as indivisibly associated; and c. perform the function(s) of a circuit. N.B.:"circuit element" is a single active or passive functional part of an electronic circuit, such as one diode, one transistor, one resistor, one capacitor, etc.